Schott Lithotec underscores leadership position
At the same time, Schott Lithotec is also engaged in two EUVL (Extreme Ultra Violett Lithography) development projects. From 2006, EUVL is expected to gradually supplant today's optical exposure method for semiconductor chips. In the future, mirrors will replace lens systems as reflecting optical elements. Schott Lithotec is preparing for this technology change in close collaboration with the research center of the Schott Group and by participating in the German EUVL project, which is sponsored by the Federal Ministry for Research, and in the European EXTUMASK program. Both projects focus on the development of suitable EUVL materials and the necessary mask blanks.
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