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Buy Products For Wafer Analysis
DM8000 M & DM12000 M by Leica
See More, Detect Faster
High-throughput Inspection Systems
Design prevents dust accumulation, currents, ensuring clean analysis and inspection chambers ✓ Maximum lateral resolution with 150X UV lens ✓ The 0.7X USP objective allows you to see a larger field, reducing analysis time ✓
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