TMP and BASF to jointly develop electronic materials for copper and barrier CMP-slurries
TMP and BASF announced that they have entered into a license and joint development agreement for copper and barrier CMP-slurries (CMP, Chemical Mechanical Planarization). This agreement will leverage TMP's leading technological position and BASF's expertise in nanotechnology, product development and global marketing and distribution. Under the agreement, BASF will manufacture and distribute these slurries to customers based outside of Japan, who are within the key markets for semiconductor materials. Further developments of the licensed products will be performed jointly with TMP.
According to BASF, the new agreement is a significant expansion of BASF's activities in the electronic materials markets and targets the highly innovative area of copper and barrier CMP-slurries. These are important process chemicals for the planarization of silicon wafers. The two companies will jointly focus on product improvements by combining BASF's chemical and nanotechnology expertise and market knowledge with TMP's application and product know how.
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