TMP and BASF to jointly develop electronic materials for copper and barrier CMP-slurries
According to BASF, the new agreement is a significant expansion of BASF's activities in the electronic materials markets and targets the highly innovative area of copper and barrier CMP-slurries. These are important process chemicals for the planarization of silicon wafers. The two companies will jointly focus on product improvements by combining BASF's chemical and nanotechnology expertise and market knowledge with TMP's application and product know how.
Other news from the department business & finance
Get the chemical industry in your inbox
From now on, don't miss a thing: Our newsletter for the chemical industry, analytics, lab technology and process engineering brings you up to date every Tuesday and Thursday. The latest industry news, product highlights and innovations - compact and easy to understand in your inbox. Researched by us so you don't have to.