W.C. Heraeus acquires technology for the manufacture of ultra-fine-pitch solder powders from Welco Potsdam
The continued miniaturization in the field of chip attachment has resulted in greater demand for solder pastes with very fine solder powders which can no longer be manufactured economically using conventional manufacturing methods. By taking over the patented technology as well as the production facilities for the manufacture of ultra-fine solder powders, Heraeus is acquiring expertise from Welco, which is unique worldwide.
The innovative strength of the global technology company Heraeus guarantees that Welco customers will not only receive the same ultra-fine solder powders in the unique quality they are accustomed to. Rather, the product spectrum will be expanded even further to enable the customers themselves to develop future oriented new products.
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