Wacker Closes Semiconductor Wafer Production in Japan
By closing its Hikari site, Siltronic continues with the structural improvements already successfully executed and adapts its production capacities to market demand. Two years ago, Siltronic has implemented a lead-site strategy enabling wafer production to be concentrated at single sites according to individual diameters. This allows for a flexible reaction on changing market trends. Discontinuing production at Siltronic’s Hikari site translates into optimized utilization rates at the company’s remaining 200 mm production facilities, higher fixed-cost coverage as well as economies of scale, resulting in a sustainably improved cost position.
“We are striving to mitigate effects on employees from the plant closure as much as we can”, says Dr. Christoph von Plotho, Siltronic’s Chief Executive Officer. According to von Plotho, Siltronic plans to offer its Hikari staff severance packages as well as consultancy and support in their search for a new employment outside the company. “At the same time, we are working hard to reap the earnings benefits resulting from this step as fast as possible”, von Plotho continued.
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