BMBF Joint Project for New Chip Fabrication Technology
Key Milestone Successfully Achieved
The German Federal Ministry of Education and Research (BMBF) is sponsoring an extensive joint project headed by Carl Zeiss on EUV lithography (Extreme Ultra Violet). This new technology has major potential to further miniaturize microchips and will play a key role in increasing their performance in the future. This project is intended to drive EUV lithography from basic industrial research to a fully capable production technology for the volume fabrication of chips. The BMBF is sponsoring the three-year project with a total of 16.4 million euros.
In addition to two companies from the Carl Zeiss Group, six other German companies and research institutes are involved in the project. Winfried Kaiser, Senior Vice President of Product Strategy for Lithography Optics at Carl Zeiss emphasizes the significance of this project by saying that “There is an excellent research and development landscape in Germany for EUV lithography. This project unites and enhances this globally leading know-how, which in the end will create attractive new jobs in Germany.”
The first key milestone was the recent comparison of the current status of EUV lithography with competing methods. The results strengthen the perspectives seen in EUV lithography. Simultaneously, the development steps initiated were verified.
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