Arieca Announces $6.5M Series A Funding Round
Company will use the investment to accelerate product development and scale up manufacturing of its Liquid Metal-based thermal interface materials
Arieca Inc., the leader in liquid-metal based thermal interface materials (TIMs) for high performance computing and high power semiconductor devices, announced a $6.5 million Series A funding round co-lead by Nissan Chemical Corporation and 412 Venture Fund, with participation from ROHM Co. Ltd., Monozukuri Venture Funds, Mountain State Capital, Innovation Works and Carnegie Mellon University.
Arieca's Team in Pittsburgh’s Headquarter. From left to right: Navid Kazem, Vivek Singh, Dylan Shah, Jeffrey Gelorme, Nolan Steeley, Allyssa Kerr
Arieca Inc.
“The semiconductor industry is facing an acute heat problem. Further progress in manufacturing of microprocessors with node sizes of 7nm, 4nm and even lower sizes in the roadmap require an acceleration in packaging technologies to compensate for the ever-growing heat densities in the next generation of devices. We, at Arieca, are developing Liquid Metal-based TIMs to give the designers the performance of liquid metals with the ease of manufacturing of thermal greases” said Dr. Navid Kazem, CEO and Co-Founder at Arieca.
“Arieca's materials are very promising innovative solutions for the market that will grow significantly in the future. We hope to make a strong cooperative collaboration on top of the Investment in the Company” said Endo Hideyuki Managing Executive Officer, and Head of Planning and Development Division at Nissan Chemical. Ilana Diamond, the general managing partner at 412 Venture added that “we have followed Arieca’s progress since their formation and have been impressed by their progress attracting customers and partners in the semiconductor industry with a large market size. We are delighted to be partnering with a world class team to help them bring an innovative material solution to a growing market.”
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